Oracle talks up new SA data centres

ITWeb | January 15, 2020

Oracle’s new data centres, due to launch in SA later this year, promise to bring unmatched performance, high security and new experiences to local organisations. This was the word from Andrew Sutherland, SVP business development, technology licence and systems at Oracle EMEA and APAC. Speaking this week during a media roundtable discussion at Oracle OpenWorld 2020, at the Dubai Trade Centre Arena, where hundreds of delegates gathered, Sutherland discussed Oracle’s plans to establish two data centres in SA before the end of the year. In September, the US-based enterprise software giant announced plans to build 20 new cloud  regions by the end of 2020, for a total of 36 Oracle Cloud Infrastructure regions. These are set to be established in SA, US, Canada, Brazil, UK, European Union (Amsterdam), Japan, Australia, India, South Korea, Singapore, Israel, Chile, Saudi Arabia and United Arab Emirates.

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Increased complexity of Al models equals increased adoption challenges Financial institutions are looking to capitalize on opportunities presented by the adoption of artificial intelligence (Al). The rapid pace of development in areas such as deep learning, conversational, and generative Al has vastly increased the scope and app


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Application Storage, Data Storage

Belden Launches New Solutions to Boost Uptime and Improve Network Connectivity

Business Wire | August 31, 2023

Belden Inc. (NYSE: BDC), a leading global supplier of network infrastructure and digitization solutions, announces four new products and updates that are designed to maintain connectivity in rugged environments and ensure uptime. Data Acquisition & Transmission Belden OptiTuff Connectivity and Cable Managementoptions support new field-termination connectivity for OptiTuff Mini Fiber Cables. Through the creation of new systems and improvements to the transition points, connectors and patch panels in Belden’s existing FiberExpress(FX) line, installers can now benefit from OptiTuff’s fast, easy installation plus compatibility with the popular FX Fusion Splice-On Connector and FX ECX Patch Panel System. The newLumberg Automation M12 Circular Connector Automotive Lineis designed to withstand harsh environments, thanks to new PUR construction, which prevents damage caused by welding sparks, crushing, and shearing. The connectors promote safety and application output by maintaining optimal machine uptime. Data Orchestration & Management Belden PROVIZE Network Planning, Commissioning and Management Suite updatessimplify MRP configuration for redundant ring topologies to prevent network disruptions. In addition, enhanced integration lets users shift between PROVIZE Planner and Explorer easily. User interface enhancements also improve both products. The newLumberg Automation LioN-X Digital I/O Modulesoffer cost-effective flexibility and fast configuration, data transfer, and data security for automation applications using digital sensors and actuators. The modules offer integration in PLC and cloud environments, making them a fit for almost all industrial applications. About Belden Belden Inc. delivers the infrastructure that makes the digital journey simpler, smarter and secure. We’re moving beyond connectivity—from what we make to what we make possible through a performance-driven portfolio, forward-thinking expertise and purpose-built solutions. With a legacy of quality and reliability spanning 120-plus years, we have a strong foundation to continue building the future. We are headquartered in St. Louis and have manufacturing capabilities in North America, Europe, Asia and Africa.

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Hyper-Converged Infrastructure

Cadence to Acquire Rambus PHY IP Assets

businesswire | July 21, 2023

Cadence Design Systems, Inc. (Nasdaq: CDNS) and Rambus Inc. (Nasdaq: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced that they have entered into a definitive agreement for Cadence to acquire the Rambus SerDes and memory interface PHY IP business. Rambus will retain its digital IP business, including memory and interface controllers and security IP. The expected technology asset purchase also brings Cadence proven and experienced PHY engineering teams in the United States, India and Canada, further expanding Cadence’s domain-rich talent base. “Memory and SerDes IP design and integration continues to be integral to the design of AI, data center and hyperscale applications, CPU architectures and networking devices, and the addition of the Rambus IP and seasoned team further accelerates Cadence’s Intelligent System Design strategy, which drives design excellence,” said Boyd Phelps, senior vice president and general manager of the IP Group at Cadence. “The acquisition of the Rambus PHY IP broadens Cadence’s well-established enterprise IP portfolio and expands its reach across geographies and vertical markets, such as the aerospace and defense market, providing complete subsystem solutions that meet the demands of our worldwide customers.” “The accelerating momentum of AI and continued growth in the data center is driving ever-increasing demand for memory and security,” said Sean Fan, senior vice president and chief operating officer at Rambus. “With this transaction, we will increase our focus on market-leading digital IP and chips and expand our roadmap of novel memory solutions to support the continued evolution of the data center and AI.” The transaction is expected to be immaterial to revenue and earnings this year for each company. It is expected to close in the third calendar quarter of 2023, subject to certain closing conditions. About Cadence Cadence is a pivotal leader in electronic systems design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design™ strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence® customers are the world’s most innovative companies, delivering extraordinary products from chips to boards to complete systems for the most dynamic market applications, including hyperscale computing, 5G communications, automotive, mobile, aerospace, consumer, industrial and healthcare. For nine years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work For. Learn more at www.cadence.com. About Rambus Rambus is a provider of industry-leading chips and silicon IP making data faster and safer. With over 30 years of advanced semiconductor experience, we are a pioneer in high-performance memory subsystems that solve the bottleneck between memory and processing for data-intensive systems. Whether in the cloud, at the edge or in your hand, real-time and immersive applications depend on data throughput and integrity. Rambus products and innovations deliver the increased bandwidth, capacity and security required to meet the world’s data needs and drive ever-greater end-user experiences. For more information, visit rambus.com.

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Hyper-Converged Infrastructure, Windows Systems and Network

Solidigm Introduces the World’s Highest Capacity PCIe SSD for Massive Data Storage From Core to Edge

businesswire | July 24, 2023

Solidigm, a leading global provider of innovative NAND flash memory solutions, is proud to announce another industry-first quad-level cell (QLC) solid-state storage drive (SSD) for the data center — the Solidigm™ D5-P5336. Offered in capacities from 7.68TB to 61.44TB, the Solidigm D5-P5336 makes it possible to store up to 6X more data in the same space compared to an all hard disk drive (HDD) array.1 "Modern workloads like AI and capabilities like 5G are rapidly reshaping the storage landscape,” said Greg Matson, VP of Strategic Planning and Marketing at Solidigm. “Businesses need storage in more places that is inexpensive, able to store massive data sets efficiently and access the data at speed. The D5-P5336 delivers on all three -- value, density and performance. With QLC, the economics are compelling -- imagine storing 6X more data than HDDs and 2X more data than TLC SSDs, all in the same space at TLC speed." Built to handle massive amounts of data from the core to the edge, the read performance of the Solidigm D5-P5336 exceeds some of the latest cost-optimized triple-level cell (TLC) SSDs on the market today.2 Artificial intelligence (AI), machine learning (ML), content delivery networks, scale-out network attached storage (NAS), and object storage are all read-intensive workloads that continue to drive enormous volumes of data, regardless of where they reside. Massive scalability and improved TCO across a range of configurations With its high capacity enabling smaller storage footprints, Solidigm’s D5-P5336 enables a lower total cost of ownership and more sustainable infrastructure than all-TLC arrays, SAS HDD arrays, or hybrid arrays. Consider the following, based on a 100PB object “For years there has been debate about endurance and reliability of SSDs, QLC in particular, but Solidigm might have ended that debate with the D5-P5336,” noted Avery Pham, VP Operations, VAST Data. “Any number of applications will see notable benefits from these drives from AI and machine learning to object storage.” "Today, it is clear that the primary constraint for edge workloads is the limitation of bandwidth rather than latency,” said Doug Emby, VP of Sales and Business Development at Cheetah RAID Storage. “Solidigm’s D5-P5336 QLC SSDs offer an impressive combination of capacity, performance, and reliability as a solution to overcome this challenge. The seamless integration of these Solidigm QLC SSDs with Cheetah's high-performance servers makes them highly suitable for the efficient deployment of edge solutions." The D5-P5336 is shipping now in E1.L form factor with up to 30.72TB, with subsequent availability extending to 61.44TB in both U.2 and E1.L later this year. In the first half of 2024, Solidigm will be shipping E3.S form factor with up to 30.72TB. 1 All-HDD capacity based on 12x 3.5” front load bays x 20TB = 240TB. HDD capacity does not factor in any over-provisioning required to meet storage performance needs. All-QLC capacity based on 24x U.2 front load bays x 61.44TB D5-P5336 = 1474TB. Max 2U U.2 based on HPE Proliant DL385 Gen 11 configuration. Max 2U 3.5” HDD bays based on Supermicro 2U SuperServer design. 2 Up to 34% higher throughput than entry TLC SSDs and 20% higher than mainstream TLC SSDs for CDN workload. Comparing 15.36TB Solidigm™ D5-P5336 with read BW of 7.5GB/sec to15.36TB Kioxia CD8-R with 5.6 GB/sec as entry TLC SSD and to 15.36TB Micron 7450 with 6.2GB/sec as mainstream TLC SSD. Workload based on representative customer profile. Test Configuration: Supermicro SYS-120U-TNR, Intel(R) Xeon(R) Gold 6354. Number of CPUs: 2, Cores per CPU: 18 (total 36), DRAM: DDR4 – 64GB, OS: Ubuntu 20.04.5 LTS Linux 5.15.0-67-generic. FIO 3.16. ABOUT SOLIDIGM Solidigm is a leading global provider of innovative NAND flash memory solutions. Solidigm technology unlocks data’s unlimited potential for customers, enabling them to fuel human advancement. Originating from the sale of Intel’s NAND and SSD business, Solidigm became a standalone U.S. subsidiary of semiconductor leader SK hynix in December 2021. Headquartered in Rancho Cordova, California, Solidigm is powered by the inventiveness of more than 2,000 employees in 13 locations worldwide. For more information, please visit solidigm.com and follow us on Twitter and LinkedIn. “Solidigm” is a trademark of SK hynix NAND Product Solutions Corp. (d/b/a Solidigm).

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Hyper-Converged Infrastructure, Data Storage

TrueNet Communications to Transform Network and Infrastructure Management with Digital Twin Technology

PR Newswire | September 01, 2023

TrueNet Communications Corp., an industry leading outside plant engineering and professional services company supporting the telecommunications market, announces the introduction of Digital Twin Technology to augment its service offerings. This groundbreaking mobile mapping solution marks a significant milestone in TrueNet Communications' commitment to delivering innovative and holistic solutions to meet current and future needs. It also represents TrueNet's expansion of services into industries including energy delivery networks, and urban, transportation and utility infrastructures. With Digital Twin Technology, TrueNet can visualize and analyze field assets in ways that were previously impossible, while simultaneously ensuring data is captured in usable outputs for future needs like predictive modeling and analysis. It's powered by state-of-the-art LiDAR and specialty photogrammetry drones that collect data and generate 3D digital replicas, or "digital twins," of field assets and environments. From optimizing network performance to enhancing infrastructure management, TrueNet's Digital Twin Technology is poised to revolutionize how companies operate. "Innovation is intrinsic to who we are and how we operate at TrueNet. We're proud to be on the forefront of finding ways to leverage new technologies, like Digital Twin Technology, to support our customers with advanced, end-to-end solutions," says Erich Schlegel, TrueNet's Chief Executive Officer. "Our customers can expect to feel the benefits of our Digital Twin approach by having access to more robust and accurate data that will enhance their overall experience." About TrueNet Communications Corp. TrueNet Communications Corp. is an industry leading outside plant (OSP) engineering, construction, and professional services company serving the largest telecommunications service providers and multi-service operators (MSOs) in North America. Since 1985, the company has provided advanced outside plant solutions by utilizing the latest innovative, exclusive, automation tools across the United States and Canada. In 2016, TrueNet was acquired by Fujitsu, one of the world's largest IT and Network services companies, adding world-class expertise and resources as a total network solution provider.

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Increased complexity of Al models equals increased adoption challenges Financial institutions are looking to capitalize on opportunities presented by the adoption of artificial intelligence (Al). The rapid pace of development in areas such as deep learning, conversational, and generative Al has vastly increased the scope and app

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