STORAGE MANAGEMENT, WINDOWS SERVER MANAGEMENT, IT SYSTEMS MANAGEMENT
Marvell | October 21, 2022
Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, today announced a comprehensive 3nm silicon platform to advance its industry-leading products across the cloud data center, carrier, enterprise, and automotive markets. Leveraging Marvell's success in 5nm, which includes the industry's first 5nm Data Processing Unit (DPU) – the OCTEON® 10 platform, this suite of advanced technology enables cutting-edge monolithic and multi-die solutions for its customers in the industry's most advanced process node, delivering the performance, power, and density (size) necessary to meet most demanding infrastructure requirements for compute, next generation 100T Ethernet switching, and 5G Advanced baseband processing.
The new 3nm Marvell silicon, which is now in fabrication with Taiwan Semiconductor Manufacturing Company (TSMC) on its 3nm shuttle, is available for new product designs and includes foundational IP building blocks such as long reach SerDes, PCIe Gen6 PHY, and several standards-based die-to-die interconnect technologies for managing data flow across the data infrastructure. This 3nm development follows numerous 5nm solutions from Marvell – in production or development – that span its unrivaled portfolio of electro-optics, switch, PHY, compute, 5G baseband, and storage products, as well as a wide range of custom ASIC programs.
Additionally, this IP portfolio is compatible with 2.5D packaging technologies such as TSMC's leading-edge 2.5D Chip-on-Wafer-on-Substrate (CoWoS) and will enable Marvell to develop some of the most advanced multi-die, multi-chiplet systems-in-package (SiP) for its industry-leading infrastructure products and co-development of custom ASIC solutions optimized for some of the most challenging infrastructure use cases, such as machine learning.
Silicon Advancing the Cloud
With data and internet traffic approximately doubling every two years, cloud service providers, software-as-a-service (SaaS) companies, and telecommunication carriers are increasingly relying on silicon optimized by semiconductor providers to deliver breakthrough performance and bandwidth while minimizing power consumption, emissions, and cost. Achieving these objectives, particularly for hyperscale cloud providers, requires silicon partners to move quickly to the most advanced process node available to take advantage of the inherent scaling benefits in power, performance, and density.
Marvell delivers a wide range of industry-leading standard products for cloud infrastructure including electro-optics, processors, accelerators, optical modules, Ethernet switches, storage controllers and PHY chips, and offers customized products through Marvell's ASIC portfolio. By developing and validating each of the critical IP blocks in silicon early in the availability of the 3nm process, Marvell can significantly accelerate customers' time-to-market while reducing the design risk and verification efforts associated with its complex monolithic or multi-die SoC designs.
"Marvell teamed with TSMC to provide our customers with the power to build high-performance, cloud-optimized solutions for the most demanding applications requiring the industry's first 3nm IP on silicon. "The 3nm platform provides advantages for a wide range of solutions, from standard and application-specific SoCs to highly custom chips with unique and innovative designs."
Raghib Hussain, President of Products & Technologies at Marvell
"TSMC is pleased to collaborate with Marvell in taping out a chip on our 3nm shuttle to validate critical cloud-focused IPs," said Yujun Li, Director of High Performance Computing Business Development at TSMC. "TSMC is looking forward to our continued collaboration with Marvell in the development of leading-edge multi-die SoCs utilizing TSMC's process and packaging technologies."
"The cloud will play an outsized role in transforming healthcare, curbing emissions, and taking on other real-world challenges, but only if cloud providers can continue to increase the overall performance and efficiency of their infrastructure," said Alan Weckel, co-founder of the 650 Group. "Marvell's collaboration with TSMC and its strategy of optimizing silicon building blocks for a wide spectrum of devices and applications is poised to play a critical role in allowing cloud providers to fulfill that promise."
To deliver the data infrastructure technology that connects the world, we're building solutions on the most powerful foundation: our partnerships with our customers. Trusted by the world's leading technology companies for over 25 years, we move, store, process and secure the world's data with semiconductor solutions designed for our customers' current needs and future ambitions. Through a process of deep collaboration and transparency, we're ultimately changing the way tomorrow's enterprise, cloud, automotive, and carrier architectures transform—for the better.
Fastly | November 10, 2022
Fastly, Inc., the world’s fastest global edge cloud platform, today announced the relaunch of its industry-leading Open Source and Nonprofit Program as “Fast Forward,” with a renewed focus on building community among the builders and maintainers of an internet that is faster, safer, and more inclusive. The announcement was made at Altitude, Fastly’s annual flagship customer conference.
Fast Forward is a set of broad-reaching programs designed to empower and support open source projects, nonprofit organizations, and developers in their endeavors to build great things with unmatched ease, performance, and security. Extending Fastly’s deep commitment to open source, Fast Forward will offer free services to open source projects and the nonprofits that support them. Fast Forward will also establish and foster a community of these stakeholders so they can interact with and learn from one another, as well as with the broader developer and open source community.
Fast Forward stems from Fastly’s mission to help make the internet a better place, where all experiences are fast, engaging, and safe. At its core, Fastly is driven to be part of an industry that is open, transparent and collaborative – working together to expand and preserve resilience, portability, and interoperability. Fastly believes companies that operate at a global scale are responsible for contributing their expertise to the communal body of knowledge which makes up the open internet: standards, protocols, open source technology, and policies.
“Providing Fastly’s best in class services to open source projects and standards initiatives has the power to drive our shared mission of making the internet a better place, It’s important for us to support the organizations that fuel Internet innovation”
-Fastly CEO Todd Nightingale
Fast Forward is just one element of Fastly’s rich heritage in open source and open standards: Fastly is a founding member of the Bytecode Alliance along with Red Hat, Mozilla, and Intel; works alongside industry partners such as Microsoft, Google, and Apple and more to contribute to Private Access Tokens; and encourages its employees to contribute to open source through projects like Pushpin, WAF Efficacy, and more – just to name a few initiatives. Fastly also has a long-standing policy for its customer community, and only works with customers and partners who reflect Fastly’s values.
There’s so much great creativity on the internet that’s inspiring but doesn’t always have the support it deserves, Fast Forward is Fastly’s commitment to helping everyone build a better internet. From open source technologies, to the fundamental protocols and standards that make the internet go, we’re telling every developer and every creator that we’ve got their backs, no matter what technologies, tools or stacks they use. We can’t wait to see how they use that potential to build and scale an even better internet,said Anil Dash, VP of Developer Experience at Fastly.
Fastly’s investment in open source has provided valuable support to organizations like the Rust Software Foundation, the Apache Software Foundation, and the Scratch Foundation. Their leaders talk about the benefits they get from Fastly’s Fast Forward Program:
Joel Marcey, Director of Operations and Advocacy at the Rust Foundation, said, As a non-profit organization supporting the Rust Project, the Rust Foundation believes the future of software development is looking brighter every day thanks to Rust's inherent benefits such as memory safety, energy efficiency, and scalability. But for the Rust Project to meet the demands of its growing popularity, diversified and cost-effective infrastructure is critical. The Rust Foundation is grateful to be included in the Fast Forward program, which will allow the Rust Project to harness Fastly's full-site delivery and powerful Compute@Edge platform at no cost. It's partnerships like these that will contribute to the growth and sustainability of Rust into the future.
Daniel Gruno, Infrastructure Architect at the Apache Foundation, said, Fastly's sponsorship allowed The Apache Software Foundation to replace a complicated mirror infrastructure with a simple content delivery network (CDN) that is largely transparent to our projects and users. In addition, it's allowed the Infrastructure team to spend less time on our distribution network and more time on higher value projects for the foundation.
Colby Gutierrez-Kraybill, Principal Software Engineer at Scratch Foundation, said, Thanks to Fastly's global reach and ongoing support, we are able to fulfill our mission at the Scratch Foundation of providing young people all over the world with digital tools and opportunities to imagine, create, share, and learn. We are grateful for Fastly's partnership, allowing us to stay flexible and agile as our platforms Scratch and ScratchJr grow globally as leading creative learning tools.
To qualify for free services through the Fast Forward Program, members must freely distribute their codebase and align with Fastly’s open source values: open, community oriented, inclusive, friendly to new contributors, and built on trust. If accepted, they in turn commit to sharing knowledge and resources with the Fast Forward community and beyond.
Fastly’s powerful and programmable edge cloud platform helps the world’s top brands deliver the fastest online experiences possible, while improving site performance, enhancing security, and empowering innovation at global scale. With world-class support that achieves 95%+ average annual customer satisfaction ratings, Fastly’s beloved suite of edge compute, delivery, and security offerings has been recognized as a leader by industry analysts such as IDC, Forrester and Gartner. Compared to legacy providers, Fastly’s powerful and modern network architecture is the fastest on the planet, empowering developers to deliver secure websites and apps at global scale with rapid time-to-market and industry-leading cost savings. Thousands of the world’s most prominent organizations trust Fastly to help them upgrade the internet experience, including Reddit, Pinterest, Stripe, Neiman Marcus, The New York Times, Epic Games, and GitHub.
APPLICATION STORAGE, IT SYSTEMS MANAGEMENT
Intel | September 28, 2022
Today at Intel Innovation, Intel revealed the 13th Gen Intel® Core™ processor family, led by the 13th Gen Intel® Core™ i9-13900K – the world’s fastest desktop processor1. The new 13th Gen Intel Core family includes six new unlocked desktop processors with up to 24 cores and 32 threads and blazing clock speeds up to 5.8 GHz for the best gaming, streaming and recording experience2.
Led by the launch of the Intel Core “K” processors, the 13th Gen Intel Core desktop family will consist of 22 processors and more than 125 partner system designs – providing an uncompromising experience in both application performance and platform compatibility. Enthusiasts can take advantage of 13th Gen Intel Core processors’ performance improvements with existing Intel® 600 or new Intel® 700 series chipset motherboards. Combined with both the latest DDR5 memory support and continued DDR4 memory support, users can enjoy the benefits of 13th Gen Intel Core while customizing their setup based on their own feature and budget preferences.
“We are raising the standards of PC performance once again with our latest generation of flagship 13th Gen Intel Core Processors,” said Michelle Johnston Holthaus, executive vice president and general manager of the Client Computing Group at Intel. “The 13th Gen Intel Core family is the latest example of how Intel is enabling amazing experiences to happen on the PC – at scale and across all PC product segments. Combine this with an industry-leading partner ecosystem and new solutions like Intel Unison, and together we are showing the world what’s truly possible with the PC experience going forward.”
A Complete, All-Around Platform to Game and Create
Building on a matured Intel 7 process and x86 performance hybrid architecture, 13th Gen Intel Core desktop processors enable better system performance – even through the most demanding of multitasking workloads. This includes up to 15% better single-threaded performance and up to 41% better multi-threaded performance3.
With this generation, Intel’s performance hybrid architecture brings together the fastest Performance-cores (P-core) ever built along with up to double the number of Efficient-cores (E-core) – delivering improved single-threaded and multi-threaded performance that enables:
World’s best gaming experience: Available with up to 24 cores (8 P-cores, 16 E-cores) and 32 threads, the new Core i9-13900K provides the best experience for gaming, streaming and recording. With up to 5.8 GHz and 15% better single-thread performance, it can push high frame rates and allow for unleashed gaming experiences across top titles4.
Continued advances in content creation performance: The 13th Gen Intel Core desktop processor lineup adds more E-cores and up to 41% better multi-threaded performance to handle multiple, compute intensive workloads to keep people in the creative flow.
An unmatched overclocking experience5: The 13th Gen Intel Core processor offers an unmatched overclocking experience for everyone – from experts to beginners. 13th Gen Intel Core processor users can see higher average overclocking speeds across P-cores, E-cores and DDR5 memory. Intel also updated its easy one-click overclocking feature, Intel® Speed Optimizer, to support 13th Gen processors so users can overclock with minimal effort. And the robust Intel® Extreme Memory Profile (XMP) 3.0 ecosystem provides a wide selection of overclocking modules. When coupled with Intel® Dynamic Memory Boost, this feature provides a hassle-free memory overclocking experience with both DDR4 and DDR5.
Rob Bartholomew, chief product officer at Creative Assembly, said, “We’ve been working with Intel for over a decade to deliver an incredible Total War experience on Intel CPUs. We’ve optimized Total War: WARHAMMER III for the hybrid 12th Gen architecture, and we’re excited to continue the work with the new 13th Gen Intel Core Processors.”
Industry-Leading Features for Desktop Platforms
The 13th Gen Intel Core desktop processors empower users with leading-edge performance and experiences across gaming, content creation and work, with several new and improved features including:
Intel® Adaptive Boost Technology and Thermal Velocity Boost opportunistically boosts processor clock frequencies based on power and thermal headroom during a given workload. Available in Intel Core i9 unlocked SKUs.
More E-cores across Intel Core i5, i7, i9 power a big leap in multi-threaded performance and better multi-tasking/mega-tasking experience for users.
PCIe Gen 5.0 support, with as many as 16 lanes off the processor.
Increased memory support to DDR5-5600 and DDR5-5200, while maintaining DDR4 compatibility.
Up to 2x the L2 cache and increased L3 cache.
Introducing the Intel 700 Series Chipset with Backward Compatibility
Alongside the 13th Gen Intel Core desktop processors, Intel is launching the new Intel 700 Series chipset with advanced features for increased reliability and performance. Eight additional PCIe Gen 4.0 lanes combined with PCIe Gen 3.0 provide 28 total lanes off the chipset, increased USB 3.2 Gen 2x2 (20Gbps) ports provide improved USB connectivity speed, and DMI Gen 4.0 increases the chipset-to-CPU throughput for fast access to peripheral devices and networking. Additionally, Intel is bringing forward and backward compatibility. Take advantage of 13th Gen Intel Core processor performance improvements with existing Intel 600 chipset-based motherboards.
Intel Unison: A Seamless Multi-Device Experience Enabling an Open Ecosystem
Following the acquisition of Screenovate showcased at CES 2022, Intel is introducing Intel® Unison™, a software solution that seamlessly connects your PC and devices for a universal, easy-to-use experience across operating systems.
Intel Unison’s initial release will deliver a continuous and seamless connectivity experience between the PC and phone, beginning with iOS and Android. Following a simple pairing process, users will be able to:
File transfer: Users save time when transferring files and photos between a PC and Android or iOS device, as well as extend the power of the PC and enjoy the continuity of taking a photo or video on a phone and seamlessly editing on the PC.
Text message: Users send and receive text messages from PCs to avoid device-switching and enjoy the comfort and ease of a full keyboard and monitor.
Phone calls: With access to a phone’s full contact list, users can make and receive voice calls directly from their PCs.
Phone notifications: Users can receive and manage phone notifications from a PC to stay connected and maintain control.
Intel Unison will launch on select Intel® Evo™ laptops based on 12th Gen Intel Core processors from Acer, HP and Lenovo this year, and will scale to 13th Gen Intel Core-based designs starting early in 2023. Intel Unison will continue to evolve with additional form factors, functionality and operating systems in the future6.
Intel is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better.