WINDOWS SERVER MANAGEMENT,IT SYSTEMS MANAGEMENT,AZURE
GRC | December 05, 2022
GRC (Green Revolution Cooling®), the leader in immersion cooling for data centers, announced today that GRC’s CRO, Jim Weynand will lead a discussion titled Data Center Sustainability is a Team Sport, which will highlight the benefits of data center immersion cooling during the Gartner IT Infrastructure, Operations & Cloud Strategies Conference 2022 at The Venetian Resort Las Vegas.
The 20-minute Exhibit Showcase will highlight how air-cooled data centers simply cannot meet the demands of today’s high-powered processors and high-density deployments. The session takes place at 1:15 pm on December 8.
Participants will learn about liquid immersion cooling solutions that meet the computing demands of today and tomorrow, and help enterprises address the sustainability, energy use, and the cost of running a data center. The session will also focus on GRC’s partnerships with leading hardware providers and cite examples of comprehensive solutions, from facility design to server selection, enabling data center operators to make the transition from air cooling to liquid immersion cooling to be environmentally friendly and address Environmental Social and Governance (ESG) goals.
“Our relationships with leading hardware providers such as Dell and Intel enable our customers to seamlessly and quickly implement changes to their data centers. We are thrilled to share the stage at this Gartner conference to educate users on the sustainability and budget benefits of using liquid immersion cooling solutions to cool their data centers.”
Jim Weynand, CRO at GRC
GRC is The Immersion Cooling Authority®. The company's patented immersion-cooling technology radically simplifies deployment of data center cooling infrastructure. By eliminating the need for chillers, CRACs, air handlers, humidity controls, and other conventional cooling components, enterprises reduce their data center design, build, energy, and maintenance costs. GRC’s solutions are deployed in twenty-one countries and are ideal for next-gen applications platforms, including artificial intelligence, blockchain, HPC, 5G, and other edge computing and core applications. Their systems are environmentally resilient, sustainable, and space saving, making it possible to deploy them in virtually any location with minimal lead time.
HYPER-CONVERGED INFRASTRUCTURE,APPLICATION INFRASTRUCTURE
Symbio | November 08, 2022
Industry-leading communications software provider Symbio Holdings, today announced the launch of Carrier Infrastructure as a Service (CIaaS) – a unified carrier-grade product suite designed to simplify the wholesale customer experience.
Symbio's CIaaS offering makes it easier for communications service providers of all sizes to launch and scale cloud collaboration services in new markets, utilising Symbio's proprietary cloud-based technology stack.
CIaaS provides the necessary physical infrastructure through Symbio's extensive voice network, together with the virtual components needed to deliver high-quality, cost-effective communications services in Australia, New Zealand, Singapore and beyond.
"The wholesale voice market is entering a new and complex era, faced with regulatory and compliance challenges that make it difficult for service providers to economically launch and scale cloud communications solutions.
Giorgio Mihaila, CEO of Symbio's Connect division
"With our Carrier Infrastructure as a Service offering, we are making it simpler and more cost-effective than ever for service providers to scale their own solutions, by removing barriers to entry into new markets so they can focus on what matters most – the customer experience.
"We've spent several years migrating core carrier functions to the cloud to be able to offer our proprietary technology stack that can move at scale, anywhere.
"Now, wholesale service providers can offer end-users all the same benefits as a tier-1 supplier, without needing to invest in their own infrastructure or go through the time-consuming process of securing a carrier license when entering new markets," he said.
Backed by 20-years of innovation and experience
Leveraging Symbio's voice network, CIaaS enables domestic service providers to access the same capabilities as leading carriers without the need for infrastructure investments to deliver reliable, quality voice communications.
In addition, CIaaS is backed by carrier-grade customer support and expertise through in-country customer service teams working locally, to support global customers for international call routing and other services. With this capability, Symbio can help service providers navigate and understand individual country licensing and regulatory challenges.
"Symbio's Carrier Infrastructure as a Service offering is designed to provide immediate benefits, with continuous updates to the product suite. As new capabilities and innovations emerge customers will automatically receive these, enabling this service to be the central marketplace for all wholesale communications needs," concluded Mr Mihaila.
Symbio is a software company changing the way the world communicates.
Symbio brings together everything needed to deploy and manage modern communication services. The Symbio platform delivers the full communication stack, from carrier infrastructure to enterprise collaboration, across multiple Asia-Pacific regions.
STORAGE MANAGEMENT, WINDOWS SERVER MANAGEMENT, IT SYSTEMS MANAGEMENT
Marvell | October 21, 2022
Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, today announced a comprehensive 3nm silicon platform to advance its industry-leading products across the cloud data center, carrier, enterprise, and automotive markets. Leveraging Marvell's success in 5nm, which includes the industry's first 5nm Data Processing Unit (DPU) – the OCTEON® 10 platform, this suite of advanced technology enables cutting-edge monolithic and multi-die solutions for its customers in the industry's most advanced process node, delivering the performance, power, and density (size) necessary to meet most demanding infrastructure requirements for compute, next generation 100T Ethernet switching, and 5G Advanced baseband processing.
The new 3nm Marvell silicon, which is now in fabrication with Taiwan Semiconductor Manufacturing Company (TSMC) on its 3nm shuttle, is available for new product designs and includes foundational IP building blocks such as long reach SerDes, PCIe Gen6 PHY, and several standards-based die-to-die interconnect technologies for managing data flow across the data infrastructure. This 3nm development follows numerous 5nm solutions from Marvell – in production or development – that span its unrivaled portfolio of electro-optics, switch, PHY, compute, 5G baseband, and storage products, as well as a wide range of custom ASIC programs.
Additionally, this IP portfolio is compatible with 2.5D packaging technologies such as TSMC's leading-edge 2.5D Chip-on-Wafer-on-Substrate (CoWoS) and will enable Marvell to develop some of the most advanced multi-die, multi-chiplet systems-in-package (SiP) for its industry-leading infrastructure products and co-development of custom ASIC solutions optimized for some of the most challenging infrastructure use cases, such as machine learning.
Silicon Advancing the Cloud
With data and internet traffic approximately doubling every two years, cloud service providers, software-as-a-service (SaaS) companies, and telecommunication carriers are increasingly relying on silicon optimized by semiconductor providers to deliver breakthrough performance and bandwidth while minimizing power consumption, emissions, and cost. Achieving these objectives, particularly for hyperscale cloud providers, requires silicon partners to move quickly to the most advanced process node available to take advantage of the inherent scaling benefits in power, performance, and density.
Marvell delivers a wide range of industry-leading standard products for cloud infrastructure including electro-optics, processors, accelerators, optical modules, Ethernet switches, storage controllers and PHY chips, and offers customized products through Marvell's ASIC portfolio. By developing and validating each of the critical IP blocks in silicon early in the availability of the 3nm process, Marvell can significantly accelerate customers' time-to-market while reducing the design risk and verification efforts associated with its complex monolithic or multi-die SoC designs.
"Marvell teamed with TSMC to provide our customers with the power to build high-performance, cloud-optimized solutions for the most demanding applications requiring the industry's first 3nm IP on silicon. "The 3nm platform provides advantages for a wide range of solutions, from standard and application-specific SoCs to highly custom chips with unique and innovative designs."
Raghib Hussain, President of Products & Technologies at Marvell
"TSMC is pleased to collaborate with Marvell in taping out a chip on our 3nm shuttle to validate critical cloud-focused IPs," said Yujun Li, Director of High Performance Computing Business Development at TSMC. "TSMC is looking forward to our continued collaboration with Marvell in the development of leading-edge multi-die SoCs utilizing TSMC's process and packaging technologies."
"The cloud will play an outsized role in transforming healthcare, curbing emissions, and taking on other real-world challenges, but only if cloud providers can continue to increase the overall performance and efficiency of their infrastructure," said Alan Weckel, co-founder of the 650 Group. "Marvell's collaboration with TSMC and its strategy of optimizing silicon building blocks for a wide spectrum of devices and applications is poised to play a critical role in allowing cloud providers to fulfill that promise."
To deliver the data infrastructure technology that connects the world, we're building solutions on the most powerful foundation: our partnerships with our customers. Trusted by the world's leading technology companies for over 25 years, we move, store, process and secure the world's data with semiconductor solutions designed for our customers' current needs and future ambitions. Through a process of deep collaboration and transparency, we're ultimately changing the way tomorrow's enterprise, cloud, automotive, and carrier architectures transform—for the better.