Ciena | September 08, 2021
Ciena Corporation has entered into a definitive agreement with AT&T to acquire its Vyatta virtual routing and switching technology.
The acquisition reflects Ciena’s continued investment in its Routing and Switching roadmap to address the growing market opportunity to transform the edge, including 5G networks and cloud environments. Specifically, these key technologies and expertise will serve to expand and accelerate Ciena’s Adaptive IP solution set. In addition, Ciena has agreed to support the Vyatta routing platform in AT&T’s wireless network across multiple 5G use cases, enterprise business services and virtual networks with cloud scalability. Ciena plans to integrate the team of engineering specialists into its Routing and Switching research and development (R&D) organization.
“The addition of the Vyatta talent and assets to our Routing and Switching business will extend Ciena’s success in helping customers create virtualized networks and deploy new features faster and cost effectively across 5G, enterprise and cloud use cases,” said Scott McFeely, Senior Vice President, Global Products and Services at Ciena.
“This agreement is a sign of the maturity of the ecosystem and encompasses years of innovation, collaboration and expertise,” said Andre Fuetsch, Chief Technology Officer of Network Services at AT&T. “Our acquisition of the Vyatta assets in 2017 helped us virtualize 75% of our network and led to the development of the first telco grade open-source network operating system. We’re looking forward to the continued use of Vyatta and the development of new use cases as a result of this transaction.”
The acquisition of the Vyatta talent and certain intellectual property is expected to close by the end of the calendar year. Financial terms were not disclosed.
Ciena is a networking systems, services and software company. We provide solutions that help our customers create the Adaptive NetworkTM in response to the constantly changing demands of their end-users. By delivering best-in-class networking technology through high-touch consultative relationships, we build the world’s most agile networks with automation, openness and scale.
prnewswire | September 23, 2020
Sercomm , a leading manufacturer and supplier of telecom equipment, today announced that its 5G Enterprise mmWave Small Cell (Model name SCE5151C-B261) has officially obtained Federal Communications Commission's Part 30 certification. Powered by the Qualcomm 5G RAN platform for a complete Modem-RF system-level solution from baseband to antennas, Sercomm's Enterprise mmWave small cell enhances in-building 5G coverage and adds data capacity to meet high traffic demand in dense urban environments.
businesswire | December 01, 2020
MaxLinear a main supplier of radio recurrence (RF), simple, advanced and blended sign coordinated circuits, reported today the expansion of its double yield power module family with the arrival of a double 18A (MxL7218) and two double 25A (MxL7225 and MxL7225-1) power modules. These recently delivered items add to the current group of intensity modules that incorporate double 4A (MxL7204) and double 13A (MxL7213) forms and address mechanical applications, for example, clinical and test gear. Moreover, these force modules supplement our industry driving foundation items, for example, 5G handsets and modems, long stretch optical TIAs and drivers, and link framework SoCs.
The double 18A and two double 25A force modules permit yields to be resembled for up to 36A or 50A per module, individually. Also, the force modules might be resembled for single force rails up to 300A. The MxL7225-1 gives added adaptability to tweak the control circle in situations where ideal transient execution is required.
Zeroed in on fueling FPGA, DSP and SoC high-current center and memory rails, these modules work from a 4.5V to 15V information voltage while giving set yield voltages from 0.6V to 1.8V. Utilizing an industry standard pinout, planners can without much of a stretch scale the force levels to coordinate the necessary burden. As force levels increment, productivity and warm execution gets key. Not exclusively do these modules have superb warm conductivity to the board, however by setting inductors remotely and limiting mold compound thickness, the case temperature can be as much as 13°C cooler without the complex inner warmth sinking structures found in contending modules.