Application Infrastructure, Storage Management
prnewswire | August 11, 2023
DataBank, a leading provider of enterprise-class edge colocation, interconnection, and managed services, announced today a new approach to building high-density data centers to accommodate High-Performance Computing (HPC). Enabling HPC, Universal Data Hall Design (UDHD) empowers businesses with the flexibility to support any deployment their workloads require.
With a market expected to reach $103.74 billion by 2030, generative AI's accelerated adoption has driven an increase in demand for high-density colocation. As technology continues to advance, data centers must be able to scale and adapt quickly to handle an increasingly diverse range of workloads – from power-dense HPC clusters to sprawling hyperscale cloud installations to traditional raised-floor, enterprise colocation.
"In order to future-proof their facilities, multi-tenant data center operators must rethink facility design, construction, and operations to allow for more flexibility and sustainability," said Eric Swartz, vice president of engineering at DataBank. "With UDHD, DataBank is able to accommodate hyperscale, traditional, and HPC all within the same, highly secure data hall."
Key elements to DataBank's Next-Gen Data Centers implementing a Universal Data Hall Design are the traditional components of data center colocation with an eye toward flexibility and resiliency:
Space - Starting with slab floor and all power and cooling infrastructure outside the data hall as the initial base, with raised floor and water to rack layers that easily can be added to any hall; this layered design approach allows any hall within the data center to be adjusted to customer needs.
Power - Support for distribution as traditional 120/208V or high density 240/415V as whips or through busway without change to the supporting infrastructure.
Cooling - With a closed chilled water loop and the layered design approach, each hall can independently support different cooling methods from flooded room to localized air delivery using raised floor and even water to the rack supporting rear door heat exchangers and/or direct chip cooling.
This design renders the additional benefit of sustainability, as efficient power and water systems reduce the consumption of resources.
"Universal Data Hall Design is crucial to innovation. As technology evolves, our data centers are able to evolve with it," said Joe Minarik, COO of DataBank. "While most of the industry is trying to navigate the here and now, we're already building the data centers of the future."
DataBank helps the world's largest enterprises, technology, and content providers ensure their data and applications are always on, always secure, always compliant, and ready to scale to meet the needs of the artificial intelligence era. Our edge colocation and infrastructure footprint consists of 65+ "HPC-ready" data centers in 27+ markets, 20 interconnection hubs, and on-ramps to an ecosystem of cloud providers with virtually unlimited reach. We combine these platforms with contract portability, managed security, compliance enablement, hands-on support, and a guarantee of 100% uptime availability, to give our customers absolute confidence in their IT infrastructure and the power to create a boundless digital future for their business.
Application Storage, Data Storage
Business Wire | August 31, 2023
Belden Inc. (NYSE: BDC), a leading global supplier of network infrastructure and digitization solutions, announces four new products and updates that are designed to maintain connectivity in rugged environments and ensure uptime.
Data Acquisition & Transmission
Belden OptiTuff Connectivity and Cable Managementoptions support new field-termination connectivity for OptiTuff Mini Fiber Cables. Through the creation of new systems and improvements to the transition points, connectors and patch panels in Belden’s existing FiberExpress(FX) line, installers can now benefit from OptiTuff’s fast, easy installation plus compatibility with the popular FX Fusion Splice-On Connector and FX ECX Patch Panel System.
The newLumberg Automation M12 Circular Connector Automotive Lineis designed to withstand harsh environments, thanks to new PUR construction, which prevents damage caused by welding sparks, crushing, and shearing. The connectors promote safety and application output by maintaining optimal machine uptime.
Data Orchestration & Management
Belden PROVIZE Network Planning, Commissioning and Management Suite updatessimplify MRP configuration for redundant ring topologies to prevent network disruptions. In addition, enhanced integration lets users shift between PROVIZE Planner and Explorer easily. User interface enhancements also improve both products.
The newLumberg Automation LioN-X Digital I/O Modulesoffer cost-effective flexibility and fast configuration, data transfer, and data security for automation applications using digital sensors and actuators. The modules offer integration in PLC and cloud environments, making them a fit for almost all industrial applications.
Belden Inc. delivers the infrastructure that makes the digital journey simpler, smarter and secure. We’re moving beyond connectivity—from what we make to what we make possible through a performance-driven portfolio, forward-thinking expertise and purpose-built solutions. With a legacy of quality and reliability spanning 120-plus years, we have a strong foundation to continue building the future. We are headquartered in St. Louis and have manufacturing capabilities in North America, Europe, Asia and Africa.
Application Infrastructure, Windows Systems and Network
businesswire | July 27, 2023
Tachyum™ announced today the release of the white paper, “Tachyum Prodigy – Solution for Data Centers that are Hungry for Energy,” explaining how Prodigy®, the world’s first Universal Processor, is ideally suited to help overcome increasingly excessive energy use in data centers.
Data centers are among the most energy-demanding facilities in the world. A report by the International Energy Agency (IEA) indicates that 3% of global electricity use comes from data centers and data transmission networks. Data centers are expected to consume 20% of the world's energy supply by 2025 as the demand for digital services continues to grow.
Tachyum’s white paper details how Prodigy delivers disruptive innovation for data centers with unprecedented power efficiency by unifying the CPU, GPGPU and TPU into a single processor die, enabling groundbreaking performance while removing the need for power-hunger, costly accelerators. The white paper further shows how this compares to other data center solutions with higher performance/watt than both CPUs and GPUs; up to 4.4x higher performance/W than Intel 8490-H for cloud computing; and up to 13.4x higher performance/W than Nvidia H100 for generative AI.
“Keeping pace with the energy demands of today’s hyperscale data centers is simply not attainable,” said Dr. Radoslav Danilak, founder and CEO of Tachyum. “Additionally, massive growth from the rapid adoption of AI can only be accomplished by enabling a single hardware platform, like Prodigy, that can handle multiple workloads and avoids the time and energy from separate, custom-built solutions. Those reading the white paper will see that this approach makes the most sense and will become more evident as power demand increases.”
Prodigy provides both the high performance required for cloud and HPC/AI workloads within a single architecture. As a Universal Processor offering utility for all workloads, Prodigy-powered data center servers can seamlessly and dynamically switch between computational domains. By eliminating the need for expensive dedicated AI hardware and dramatically increasing server utilization, Prodigy reduces CAPEX and OPEX significantly while delivering unprecedented data center performance, power, and economics. Prodigy integrates 128 high-performance custom-designed 64-bit compute cores, to deliver up to 4x the performance of the highest-performing x86 processors for cloud workloads, up to 3x that of the highest performing GPU for HPC, and 6x for AI applications.
Tachyum is transforming the economics of AI, HPC, public and private cloud workloads with Prodigy, the world’s first Universal Processor. Prodigy unifies the functionality of a CPU, a GPGPU, and a TPU in a single processor that delivers industry-leading performance, cost, and power efficiency for both specialty and general-purpose computing. When hyperscale data centers are provisioned with Prodigy, all AI, HPC, and general-purpose applications can run on the same infrastructure, saving companies billions of dollars in hardware, footprint, and operational expenses. As global data center emissions contribute to a changing climate, and consume more than four percent of the world’s electricity—projected to be 10 percent by 2030—the ultra-low power Prodigy Universal Processor is a potential breakthrough for satisfying the world’s appetite for computing at a lower environmental cost. Prodigy, now in its final stages of testing and integration before volume manufacturing, is being adopted in prototype form by a rapidly growing customer base, and robust purchase orders signal a likely IPO in late 2024. Tachyum has offices in the United States and Slovakia.