Dell releases new infrastructure storage platform

Dell | May 06, 2020

Dell Technologies has this week launched Dell EMC PowerStore, a new storage platform built with the tenets of speed and 99.9999% availability at its core. According to Dell’s president and general manager of storage, Dan Irbar, customers often told the company that a growing number of workloads were stopping them from achieving their digital transformation initiatives. “From traditional IT applications to data analytics –and the reality of cost constraints, limitations and complexity of their existing IT infrastructure.” As a result, the company developed a platform that integrates automation, next-generation technology and software architecture to help organisations overcome workload barriers.

Spotlight

Scalability, reliability, and accessibility are a few factors that entreat companies to go for cloud computing services. This infrastructure leverages enterprises to transform their traditional storage and computing system into the fully managed cloud platform. These cloud platforms are fully scalable when demanded.

Spotlight

Scalability, reliability, and accessibility are a few factors that entreat companies to go for cloud computing services. This infrastructure leverages enterprises to transform their traditional storage and computing system into the fully managed cloud platform. These cloud platforms are fully scalable when demanded.

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HYPER-CONVERGED INFRASTRUCTURE, APPLICATION STORAGE

Semtech Unveils New Products for Next-gen Data Centers, PON, and 5G Networks

Semtech | March 10, 2023

Semtech Corporation, a high-performance semiconductor-making and cloud connectivity service provider, recently revealed number of new products in its Signal Integrity portfolio. These products extend the company's leadership in optical fiber integrated circuit solutions for data centers, passive optical networks (PON), and wireless. The new products offer customers low-power, low-latency, and low-cost solutions for wireless infrastructure, access and enterprise networking, and hyperscale data center applications. The digital revolution, fueled by the rapid adoption of artificial intelligence (AI), IoT-based technology, automotive, cloud services, mobile subscriptions, and others, is rapidly increasing the data used worldwide. This makes it necessary for data centers, PON networks, and wireless networks to have higher data rates. To support global data usage and the higher rates, Semtech's optical networking platform offers the backbone IC technology. Semtech continue supporting the data center, PON, and wireless networks by adding more award-winning optical products such as Tri-Edge, CopperEdge, FiberEdge, and PON-X. This helps customers to meet their current and future optical networking needs with the benefits of power, cost, and latency. Timothy Vang, Vice President of marketing and applications in Semtech’s Signal Integrity Group, remarked, “Optical solutions are vital to connect and enable high performance digital platforms. By improving networks at the chip level, Semtech is allowing our customers to prepare their networks for the exponential growth in data demands expected in the next few years. These new products, announced at OFC, underscore our leading position in the market and Semtech’s ability to address every level of the digital ecosystem including optical module customers, system providers and end users.” (Source: Business Wire) Semtech announced several new products at OFC 2023: 200G/lane optical link with Broadcom and Keysight - live demo PON-X chipset for 50G High Speed PON (HS-PON) GN1300 and GN1400 TIAs - production availability PON-X platform expansion for 10G PON ONUs Mobile Optical Pluggable Alliance (MOPA) FiberEdge GN1814 TIA - production availability FiberEdge GN1825 octal transimpedance amplifier(TIA) - sampling availability Semtech's Signal Integrity portfolio platform handles optical and copper interconnect needs for data rates from 2.5G to 1.6T in data center, PON, and wireless networking applications. It's high performance analog design solutions are used in the Signal Integrity platform. About Semtech Founded in 1960 and headquartered in Camarillo (California), Semtech Corporation is a service provider for high-performance semiconductors, internet of things (IoT) systems, and cloud connectivity.

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HYPER-CONVERGED INFRASTRUCTURE

Kioxia Showcases Next-Gen SSDs at CES 2023

KIOXIA America, Inc. | January 09, 2023

Leading flash memory and SSD supplier, Kioxia, showcased new products and technologies designed to be future-ready at this year’s CES 2023. Kioxia was the first to introduce NAND and 3D flash memory drives, and today, KIOXIA’s varied portfolio of flash storage solutions is designed to meet the ever-changing technological environment, where evolving standards drive performance levels higher. The SSD products made by KIOXIA are built with BiCS FLASHTM 3D flash memory, which makes them ideal for client PCs, enterprise servers and storage, and cloud data centers. Kioxia’s flash memory and solid-state drives (SSD), are used to power vital information infrastructure like data centers, smartphones, PCs, and other devices that are important to people's lives worldwide. "Whether it's the next connected vehicle, the next personal mobility device or the next smart city – we keep advancing flash memory to make the next thing possible, Countless consumer devices and applications require flash memory and SSDs, and we are committed to continued innovation." Alex Mei, vice president of corporate marketing for KIOXIA America, Inc. KIOXIA CES exhibit at the Venetian® Meeting Center from January 5-7 included: Scalable BiCS FLASH™ 3D flash memory technology solutions – including XL-FLASH™ and 4-bit per cell quad-level-cell (QLC) technology Flash memory solutions for automotive, consumer and industrial applications – including SLC NAND, UFS 4.0 and XFMEXPRESS™ A broad lineup of KIOXIA SSDs - representing the latest standards, technologies, and form factors KIOXIA client SSDs – including XG8 and BG5 Series NVMe™ SSDs About KIOXIA America, Inc KIOXIA America, Inc. is the U.S. subsidiary of KIOXIA Corporation. From the creation of flash memory to the ground-breaking BiCS FLASHTM 3D technology of today, KIOXIA has led the way in developing cutting-edge memory, SSD, and software solutions that improve people's lives and broaden the boundaries of society. The company's Yokkaichi Plant is one of the world's largest and highly efficient flash memory manufacturing facilities. In addition, the company continues to meet the increasing demand for memory worldwide by deploying advanced manufacturing processes that use AI.

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IDTechEx Discusses Thermal Interface Materials Breaking the Status Quo as EV Batteries Evolve

IDTechEx | March 27, 2023

Thermal Interface Material (TIM) plays an important role in power electronics, computing processors, sensors, and energy storage devices. TIMs are the materials used to fill the void between heat sources and heat sinks to enhance heat transfer. TIMs come in a variety of forms, including gap pads, thermal greases, thermally conductive adhesives, and phase change materials. The form varies significantly across target application areas, cost, and ease of mass deployment. With the ever-increasing power demand and heat generation for many emerging industries, such as data centers, 5G, and advanced driver-assistance systems (ADAS), TIMs are experiencing rapid growth and evolution, leading to significant market opportunities and massive potential for each of the target industries. Electric Vehicles (EVs) are a fast-growing market; IDTechEx forecasts that electric vehicle markets across land, sea, and air will generate US$2.6 trillion by 2042 with a double-digit annual growth rate. The battery is undoubtedly one of the most important components of an EV. Together with the fast adoption of EVs, there is also a trend for higher power density, larger battery capacity, and faster charging. TCAs have the fastest growth but gap fillers retain their dominant position over the next ten years. Source: IDTechEx - "Thermal Interface Materials 2023-2033: Technologies, Markets and Opportunities". The most used TIM forms in the EV battery industry include gap pads, gap fillers, and thermally conductive adhesives (TCAs). There is no "one-size-fits-all" solution when it comes to TIM form, and the choice is ultimately subject to battery design configuration. Gap filler is by far the most widely adopted TIM for EV batteries at this stage, thanks to their superior ability to be efficiently dispensed at high volumes. However, in order to increase energy density and achieve a longer range, EV batteries have been shifting from modular to cell-to-pack designs. This shift is expected to have profound impacts on the adoption of TIMs. Modular battery designs consist of multiple individual battery modules connected to form a battery pack. Each module has a separate casing and requires a separate TIM to transfer heat from the cell to the cooling system. In contrast, the cell-to-pack design combines the battery cells into a single, large battery module, eliminating the need for separate module housings and TIMs. This battery transition reduces TIM usage per vehicle as there are fewer thermal interfaces between the cells and the cooling plate. The elimination of module housings means cells can directly contact the cooling plate, thereby changing the performance requirements of the TIM. The TIM needs to transfer heat efficiently to avoid hotspots, as well as present good material compatibility with the cold plate. As the TIMs are positioned directly between the cells and the cold plate, an increased adhesion of TIMs is needed to stick the cells and cold plates together. Therefore, IDTechEx forecasts thermally conductive adhesives to be increasingly adopted thanks to this battery design transition, and by 2020, the market size of TCA within the EV industry is expected to have a 15-fold increase. More details about the opportunities associated with this transition are included in IDTechEx's latest research, "Thermal Interface Materials 2023-2033: Technologies, Markets and Opportunities". About IDTechEx IDTechEx guides your strategic business decisions through its Research, Subscription and Consultancy products, helping you profit from emerging technologies.

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