HYPER-CONVERGED INFRASTRUCTURE, APPLICATION INFRASTRUCTURE
Spectra Logic | September 26, 2022
Spectra Logic, a global leader in data management and data storage solutions, today announced a collaboration with the iRODS Consortium to create a joint solution built upon Spectra Vail® software, Spectra BlackPearl® S3 storage and the iRODS data management platform. The combined solution enables customers to use industry-standard cloud interfaces for on-premises disk and on-premises glacier* storage with object tape, while unlocking multi-site/multi-cloud capabilities.
The iRODS integration with BlackPearl S3 allows organizations to leverage the performance and cost benefits of on-premises glacier storage as disk or tape to access “cold” data and automate workflows, while the integration with Vail provides access to cloud services across multiple clouds. Spectra Vail software and BlackPearl S3 storage have been tested with the iRODS S3 storage resource plugin to fully support the Amazon® S3 abstraction that iRODS delivers. The new functionality is available as part of the iRODS 4.2.11 release.
"Organizations that need an on-prem glacier tier will see many benefits with the interoperability between BlackPearl S3 and the iRODS data management platform. “Organizations will be able to take full advantage of on-prem storage and the public, private and hybrid cloud by leveraging the Vail and iRODS integration.”
David Feller, Spectra Logic vice president of product management and solutions engineering
"The combined Spectra Logic and iRODS solution will enable organizations that rely heavily on tape to archive petabytes of valuable digital data economically and efficiently in a glacier-like tier,” said Terrell Russell, executive director of the iRODS Consortium. “We look forward to a lasting collaboration with Spectra Logic that will help our mutual customers drive innovation and accelerate business results."
About the iRODS Consortium
The iRODS Consortium is a membership-based organization that guides development and support of iRODS as free open-source software for data discovery, workflow automation, secure collaboration, and data virtualization. The iRODS Consortium provides a production-ready iRODS distribution and iRODS professional integration services, training, and support. The consortium is administered by founding member RENCI, a research institute for applications of cyberinfrastructure located at the University of North Carolina at Chapel Hill, USA.
About Spectra Logic
Spectra Logic develops a full range of Attack Hardened™ data management and data storage solutions for a multi-cloud world. Dedicated solely to data storage innovation for more than 40 years, Spectra Logic helps organizations modernize their IT infrastructures and protect and preserve their data with a broad portfolio of solutions that enable them to manage, migrate, store and preserve business data long-term, along with features to make them ransomware resilient, whether on-premises, in a single cloud, across multiple clouds, or in all locations at once.
HYPER-CONVERGED INFRASTRUCTURE,APPLICATION INFRASTRUCTURE,DATA STORAGE
MoEngage | November 17, 2022
MoEngage, the insights-led customer engagement platform, today announced its new product, MoEngage Inform, a unified messaging infrastructure that enables brands to build and manage multichannel transactional alerts through one API.
Consumers expect immediate updates on critical transactional notifications at their fingertips. Using MoEngage Inform, brands can provide real-time transactional alerts to improve the customer experience, such as an order or booking confirmation after a product is purchased, a delivery notification when a package arrives, one-time passwords (OTPs) for approving transactions or logging in securely, or notifications around password resets, among other time-sensitive alerts.
Oftentimes, building, updating, and delivering these critical alerts requires significant engineering bandwidth and resources. There is a heavy reliance on development teams to maintain a transactional messaging infrastructure and add new channels; in some cases, integrating a new vendor or new communication channel provider can take at least eight weeks of engineering efforts.
Moreover, brands often encounter a siloed customer experience due to multiple delivery providers and API demands, resulting in limited visibility into customers' actions. There is no unified view of notifications received by customers, meaning product teams cannot easily identify if a customer has already received or has acted on an alert; potentially leading to customers receiving duplicate alerts across channels.
Inform makes transactional alert management seamless so brands can focus more on delivering the cohesive, time-sensitive messages that consumers want. Inform's single API requires a one-time setup, freeing up engineering bandwidth and pushing control to the product or marketing teams. MoEngage Inform is a component of the MoEngage Customer Engagement Platform, which together enables brands to have one platform to support all of their customer messaging and notifications needs, both transactional and marketing-related. Product and marketing teams will be able to have a unified view of the customer journey, so they can collectively understand and gather insights to inform future initiatives to deliver a better customer experience.
With MoEngage Inform, brands can achieve:
Unified Customer Experiences - Get a unified view of how customers engage with the brand, including transactional and promotional messages across channels, and leverage an advanced algorithm that uses AI to determine what channels each customer prefers to receive critical alerts on and set a priority order automatically.
Centralized Visibility and Performance - Track and optimize the performance of your multichannel transactional and promotional messages in one central dashboard.
Reduced Engineering Resources and Improved Effectiveness - Power all transactional messaging with a single API and integrate with any communication channel with ease, supporting more than 30 providers.
More Autonomy, Faster Delivery of Alerts - Get out-of-the-box templates to create new alerts in minutes, with alerts being delivered in under 5 seconds. A built-in fallback mechanism ensures critical alerts are delivered on other channels upon disruptions.
Improved Data Security and Reporting - Achieve unified notification logs and delivery reports across channels, making identifying and debugging issues easier.
"As organizations grow, their messaging and communication needs become more complex. With MoEngage Inform, engineering teams can focus on delivering core offerings instead of building backend infrastructures, and product and marketing teams can deliver critical transactional alerts without breaking customer experiences," said Raviteja Dodda, CEO and co-founder of MoEngage.
STORAGE MANAGEMENT, WINDOWS SERVER MANAGEMENT, IT SYSTEMS MANAGEMENT
Marvell | October 21, 2022
Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, today announced a comprehensive 3nm silicon platform to advance its industry-leading products across the cloud data center, carrier, enterprise, and automotive markets. Leveraging Marvell's success in 5nm, which includes the industry's first 5nm Data Processing Unit (DPU) – the OCTEON® 10 platform, this suite of advanced technology enables cutting-edge monolithic and multi-die solutions for its customers in the industry's most advanced process node, delivering the performance, power, and density (size) necessary to meet most demanding infrastructure requirements for compute, next generation 100T Ethernet switching, and 5G Advanced baseband processing.
The new 3nm Marvell silicon, which is now in fabrication with Taiwan Semiconductor Manufacturing Company (TSMC) on its 3nm shuttle, is available for new product designs and includes foundational IP building blocks such as long reach SerDes, PCIe Gen6 PHY, and several standards-based die-to-die interconnect technologies for managing data flow across the data infrastructure. This 3nm development follows numerous 5nm solutions from Marvell – in production or development – that span its unrivaled portfolio of electro-optics, switch, PHY, compute, 5G baseband, and storage products, as well as a wide range of custom ASIC programs.
Additionally, this IP portfolio is compatible with 2.5D packaging technologies such as TSMC's leading-edge 2.5D Chip-on-Wafer-on-Substrate (CoWoS) and will enable Marvell to develop some of the most advanced multi-die, multi-chiplet systems-in-package (SiP) for its industry-leading infrastructure products and co-development of custom ASIC solutions optimized for some of the most challenging infrastructure use cases, such as machine learning.
Silicon Advancing the Cloud
With data and internet traffic approximately doubling every two years, cloud service providers, software-as-a-service (SaaS) companies, and telecommunication carriers are increasingly relying on silicon optimized by semiconductor providers to deliver breakthrough performance and bandwidth while minimizing power consumption, emissions, and cost. Achieving these objectives, particularly for hyperscale cloud providers, requires silicon partners to move quickly to the most advanced process node available to take advantage of the inherent scaling benefits in power, performance, and density.
Marvell delivers a wide range of industry-leading standard products for cloud infrastructure including electro-optics, processors, accelerators, optical modules, Ethernet switches, storage controllers and PHY chips, and offers customized products through Marvell's ASIC portfolio. By developing and validating each of the critical IP blocks in silicon early in the availability of the 3nm process, Marvell can significantly accelerate customers' time-to-market while reducing the design risk and verification efforts associated with its complex monolithic or multi-die SoC designs.
"Marvell teamed with TSMC to provide our customers with the power to build high-performance, cloud-optimized solutions for the most demanding applications requiring the industry's first 3nm IP on silicon. "The 3nm platform provides advantages for a wide range of solutions, from standard and application-specific SoCs to highly custom chips with unique and innovative designs."
Raghib Hussain, President of Products & Technologies at Marvell
"TSMC is pleased to collaborate with Marvell in taping out a chip on our 3nm shuttle to validate critical cloud-focused IPs," said Yujun Li, Director of High Performance Computing Business Development at TSMC. "TSMC is looking forward to our continued collaboration with Marvell in the development of leading-edge multi-die SoCs utilizing TSMC's process and packaging technologies."
"The cloud will play an outsized role in transforming healthcare, curbing emissions, and taking on other real-world challenges, but only if cloud providers can continue to increase the overall performance and efficiency of their infrastructure," said Alan Weckel, co-founder of the 650 Group. "Marvell's collaboration with TSMC and its strategy of optimizing silicon building blocks for a wide spectrum of devices and applications is poised to play a critical role in allowing cloud providers to fulfill that promise."
To deliver the data infrastructure technology that connects the world, we're building solutions on the most powerful foundation: our partnerships with our customers. Trusted by the world's leading technology companies for over 25 years, we move, store, process and secure the world's data with semiconductor solutions designed for our customers' current needs and future ambitions. Through a process of deep collaboration and transparency, we're ultimately changing the way tomorrow's enterprise, cloud, automotive, and carrier architectures transform—for the better.