Application Infrastructure, Windows Systems and Network
businesswire | July 27, 2023
Tachyum™ announced today the release of the white paper, “Tachyum Prodigy – Solution for Data Centers that are Hungry for Energy,” explaining how Prodigy®, the world’s first Universal Processor, is ideally suited to help overcome increasingly excessive energy use in data centers.
Data centers are among the most energy-demanding facilities in the world. A report by the International Energy Agency (IEA) indicates that 3% of global electricity use comes from data centers and data transmission networks. Data centers are expected to consume 20% of the world's energy supply by 2025 as the demand for digital services continues to grow.
Tachyum’s white paper details how Prodigy delivers disruptive innovation for data centers with unprecedented power efficiency by unifying the CPU, GPGPU and TPU into a single processor die, enabling groundbreaking performance while removing the need for power-hunger, costly accelerators. The white paper further shows how this compares to other data center solutions with higher performance/watt than both CPUs and GPUs; up to 4.4x higher performance/W than Intel 8490-H for cloud computing; and up to 13.4x higher performance/W than Nvidia H100 for generative AI.
“Keeping pace with the energy demands of today’s hyperscale data centers is simply not attainable,” said Dr. Radoslav Danilak, founder and CEO of Tachyum. “Additionally, massive growth from the rapid adoption of AI can only be accomplished by enabling a single hardware platform, like Prodigy, that can handle multiple workloads and avoids the time and energy from separate, custom-built solutions. Those reading the white paper will see that this approach makes the most sense and will become more evident as power demand increases.”
Prodigy provides both the high performance required for cloud and HPC/AI workloads within a single architecture. As a Universal Processor offering utility for all workloads, Prodigy-powered data center servers can seamlessly and dynamically switch between computational domains. By eliminating the need for expensive dedicated AI hardware and dramatically increasing server utilization, Prodigy reduces CAPEX and OPEX significantly while delivering unprecedented data center performance, power, and economics. Prodigy integrates 128 high-performance custom-designed 64-bit compute cores, to deliver up to 4x the performance of the highest-performing x86 processors for cloud workloads, up to 3x that of the highest performing GPU for HPC, and 6x for AI applications.
Tachyum is transforming the economics of AI, HPC, public and private cloud workloads with Prodigy, the world’s first Universal Processor. Prodigy unifies the functionality of a CPU, a GPGPU, and a TPU in a single processor that delivers industry-leading performance, cost, and power efficiency for both specialty and general-purpose computing. When hyperscale data centers are provisioned with Prodigy, all AI, HPC, and general-purpose applications can run on the same infrastructure, saving companies billions of dollars in hardware, footprint, and operational expenses. As global data center emissions contribute to a changing climate, and consume more than four percent of the world’s electricity—projected to be 10 percent by 2030—the ultra-low power Prodigy Universal Processor is a potential breakthrough for satisfying the world’s appetite for computing at a lower environmental cost. Prodigy, now in its final stages of testing and integration before volume manufacturing, is being adopted in prototype form by a rapidly growing customer base, and robust purchase orders signal a likely IPO in late 2024. Tachyum has offices in the United States and Slovakia.
Hyper-Converged Infrastructure, Windows Systems and Network
businesswire | July 24, 2023
Solidigm, a leading global provider of innovative NAND flash memory solutions, is proud to announce another industry-first quad-level cell (QLC) solid-state storage drive (SSD) for the data center — the Solidigm™ D5-P5336. Offered in capacities from 7.68TB to 61.44TB, the Solidigm D5-P5336 makes it possible to store up to 6X more data in the same space compared to an all hard disk drive (HDD) array.1
"Modern workloads like AI and capabilities like 5G are rapidly reshaping the storage landscape,” said Greg Matson, VP of Strategic Planning and Marketing at Solidigm. “Businesses need storage in more places that is inexpensive, able to store massive data sets efficiently and access the data at speed. The D5-P5336 delivers on all three -- value, density and performance. With QLC, the economics are compelling -- imagine storing 6X more data than HDDs and 2X more data than TLC SSDs, all in the same space at TLC speed."
Built to handle massive amounts of data from the core to the edge, the read performance of the Solidigm D5-P5336 exceeds some of the latest cost-optimized triple-level cell (TLC) SSDs on the market today.2 Artificial intelligence (AI), machine learning (ML), content delivery networks, scale-out network attached storage (NAS), and object storage are all read-intensive workloads that continue to drive enormous volumes of data, regardless of where they reside.
Massive scalability and improved TCO across a range of configurations
With its high capacity enabling smaller storage footprints, Solidigm’s D5-P5336 enables a lower total cost of ownership and more sustainable infrastructure than all-TLC arrays, SAS HDD arrays, or hybrid arrays. Consider the following, based on a 100PB object
“For years there has been debate about endurance and reliability of SSDs, QLC in particular, but Solidigm might have ended that debate with the D5-P5336,” noted Avery Pham, VP Operations, VAST Data. “Any number of applications will see notable benefits from these drives from AI and machine learning to object storage.”
"Today, it is clear that the primary constraint for edge workloads is the limitation of bandwidth rather than latency,” said Doug Emby, VP of Sales and Business Development at Cheetah RAID Storage. “Solidigm’s D5-P5336 QLC SSDs offer an impressive combination of capacity, performance, and reliability as a solution to overcome this challenge. The seamless integration of these Solidigm QLC SSDs with Cheetah's high-performance servers makes them highly suitable for the efficient deployment of edge solutions."
The D5-P5336 is shipping now in E1.L form factor with up to 30.72TB, with subsequent availability extending to 61.44TB in both U.2 and E1.L later this year. In the first half of 2024, Solidigm will be shipping E3.S form factor with up to 30.72TB.
1 All-HDD capacity based on 12x 3.5” front load bays x 20TB = 240TB. HDD capacity does not factor in any over-provisioning required to meet storage performance needs. All-QLC capacity based on 24x U.2 front load bays x 61.44TB D5-P5336 = 1474TB. Max 2U U.2 based on HPE Proliant DL385 Gen 11 configuration. Max 2U 3.5” HDD bays based on Supermicro 2U SuperServer design.
2 Up to 34% higher throughput than entry TLC SSDs and 20% higher than mainstream TLC SSDs for CDN workload. Comparing 15.36TB Solidigm™ D5-P5336 with read BW of 7.5GB/sec to15.36TB Kioxia CD8-R with 5.6 GB/sec as entry TLC SSD and to 15.36TB Micron 7450 with 6.2GB/sec as mainstream TLC SSD. Workload based on representative customer profile. Test Configuration: Supermicro SYS-120U-TNR, Intel(R) Xeon(R) Gold 6354. Number of CPUs: 2, Cores per CPU: 18 (total 36), DRAM: DDR4 – 64GB, OS: Ubuntu 20.04.5 LTS Linux 5.15.0-67-generic. FIO 3.16.
Solidigm is a leading global provider of innovative NAND flash memory solutions. Solidigm technology unlocks data’s unlimited potential for customers, enabling them to fuel human advancement. Originating from the sale of Intel’s NAND and SSD business, Solidigm became a standalone U.S. subsidiary of semiconductor leader SK hynix in December 2021. Headquartered in Rancho Cordova, California, Solidigm is powered by the inventiveness of more than 2,000 employees in 13 locations worldwide. For more information, please visit solidigm.com and follow us on Twitter and LinkedIn. “Solidigm” is a trademark of SK hynix NAND Product Solutions Corp. (d/b/a Solidigm).
businesswire | July 21, 2023
Cadence Design Systems, Inc. (Nasdaq: CDNS) and Rambus Inc. (Nasdaq: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced that they have entered into a definitive agreement for Cadence to acquire the Rambus SerDes and memory interface PHY IP business. Rambus will retain its digital IP business, including memory and interface controllers and security IP. The expected technology asset purchase also brings Cadence proven and experienced PHY engineering teams in the United States, India and Canada, further expanding Cadence’s domain-rich talent base.
“Memory and SerDes IP design and integration continues to be integral to the design of AI, data center and hyperscale applications, CPU architectures and networking devices, and the addition of the Rambus IP and seasoned team further accelerates Cadence’s Intelligent System Design strategy, which drives design excellence,” said Boyd Phelps, senior vice president and general manager of the IP Group at Cadence. “The acquisition of the Rambus PHY IP broadens Cadence’s well-established enterprise IP portfolio and expands its reach across geographies and vertical markets, such as the aerospace and defense market, providing complete subsystem solutions that meet the demands of our worldwide customers.”
“The accelerating momentum of AI and continued growth in the data center is driving ever-increasing demand for memory and security,” said Sean Fan, senior vice president and chief operating officer at Rambus. “With this transaction, we will increase our focus on market-leading digital IP and chips and expand our roadmap of novel memory solutions to support the continued evolution of the data center and AI.”
The transaction is expected to be immaterial to revenue and earnings this year for each company. It is expected to close in the third calendar quarter of 2023, subject to certain closing conditions.
Cadence is a pivotal leader in electronic systems design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design™ strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence® customers are the world’s most innovative companies, delivering extraordinary products from chips to boards to complete systems for the most dynamic market applications, including hyperscale computing, 5G communications, automotive, mobile, aerospace, consumer, industrial and healthcare. For nine years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work For. Learn more at www.cadence.com.
Rambus is a provider of industry-leading chips and silicon IP making data faster and safer. With over 30 years of advanced semiconductor experience, we are a pioneer in high-performance memory subsystems that solve the bottleneck between memory and processing for data-intensive systems. Whether in the cloud, at the edge or in your hand, real-time and immersive applications depend on data throughput and integrity. Rambus products and innovations deliver the increased bandwidth, capacity and security required to meet the world’s data needs and drive ever-greater end-user experiences. For more information, visit rambus.com.