HYPER-CONVERGED INFRASTRUCTURE, WINDOWS SYSTEMS AND NETWORK
prnewswire | April 28, 2023
EdgeCore Digital Infrastructure, a wholesale data center developer, owner and operator, announced the expansion of its data center campus in Mesa, AZ, located in the greater Phoenix area. Additionally, EdgeCore announced it has received the Green Building Initiative's Green Globes for Existing Buildings certification for its adoption of sustainable building best practices at the initial data center on the campus.
"Water scarcity is a growing concern in several states, including Arizona. EdgeCore endeavors to make decisions with the good of our environment as well as our customers in mind," said Jason Evans, Vice President Energy and Sustainability, EdgeCore. "As such, we implemented an air-cooled design in our data centers in Mesa, Arizona, that includes an ultra-efficient close-looped chilled water system, which carries a benchmark water usage effectiveness (WUE) rating below .01 L/kWh—a benefit to both the environment and our tenants' total cost of ownership."
At full build-out, EdgeCore's LEED and Energy Star designed campus in greater Phoenix will be capable of supporting a minimum of 200 MW of critical load and will be engineered to meet current and future customer requirements across 1.1+ million square feet of space. Low-cost utility power is already available at the site, as is access to multiple long-haul fiber routes operated by national and regional carriers, all of which enables reliable, low-latency connectivity to key cloud regions.
"We are pleased to see EdgeCore moving forward with the expansion of their air-cooled data center campus in Mesa," said Bill Jabjiniak, Mesa Economic Development Director. "EdgeCore's sustainable approach to providing critical data center service is important to the City of Mesa."
In part due to its sustainable facility design, EdgeCore's data centers in Mesa qualify for two separate tax incentives through the State of Arizona, resulting in 20 years of cost savings for customers. The first incentive includes a 10-year TPT, or sales tax, and use tax exemptions at the state, county and local levels on qualifying data center equipment purchases and labor services. The second 10-year tax incentive is unique to data center operators such as EdgeCore that construct facilities using green building standards.
Administered by the Green Building Initiative (GBI), Green Globes for Existing Buildings is a nationally recognized green rating assessment and certification system that ensures projects meet clearly defined criteria in six assessment areas: ESG Management, Site, Energy, Materials, and Indoor Environmental Quality. In addition to evaluating EdgeCore documentation in each of these performance areas, the Green Globes certification process included an onsite project walkthrough of EdgeCore's PH01 data center to verify implementation.
In November 2022, EdgeCore was acquired by Partners Group, a leading global private markets firm, acting on behalf of its clients. Partners Group will invest up to USD $1.2 billion to fund the acquisition and buildout of existing and future data center sites. Today's expansion announcement in the greater Phoenix area is the third of several development projects EdgeCore has planned for 2023, the first of which was announced in January for Silicon Valley, and the second which was announced in March for Northern Virginia.
About EdgeCore Digital Infrastructure
EdgeCore Digital Infrastructure serves the world's largest cloud, internet, and technology companies with both ready-for-occupancy and build-to-suit data center capacity supported by best-in-class service-delivery capabilities. Privately held and supported by committed equity to fund an initial aggregate amount of over USD $4 billion in development, EdgeCore supports customer requirements by proactively investing in land, power, and vertical development in key data center locations, with building designs that meet key performance specifications, safety metrics, and sustainability objectives. EdgeCore has four markets with power and shovel ready campuses, operational data center buildings, and the ability to expand investment into new markets
prnewswire | May 29, 2023
TYAN®, an industry-leading server platform design manufacturer and a subsidiary of MiTAC Computing Technology Corporation, will be showcasing its latest HPC, cloud and storage platforms at Computex 2023, Booth #M0701a in Taipei, Taiwan from May 30 to June 2. These platforms are powered by AMD EPYC™ 9004 Series processors, which offer superior energy efficiency and are designed to enhance data center computing performance.
"As businesses increasingly prioritize sustainability in their operations, data centers - which serve as the computational core of an organization - offer a significant opportunity to improve efficiency and support ambitious sustainability targets," said Eric Kuo, Vice President of the Server Infrastructure Business Unit at MiTAC Computing Technology Corporation. "TYAN's server platforms powered by 4th Gen AMD EPYC processor enable IT organizations to achieve high performance while remaining cost-effective and contributing to environmental sustainability."
Accelerate real workload performance for modern AI and HPC applications
Leveraging 4th Gen AMD EPYC processors' support for high performance DDR5 memory and fast PCIe® Gen 5 I/O, TYAN's HPC platforms enable the high performance demands of today's AI and machine learning applications. The Transport HX TN85-B8261 is a 2U dual-socket server that is equipped with 24 DDR5 RDIMM slots and eight 2.5-inch hot-swap NVMe U.2 tool-less drive trays. The platform supports up to four double-wide GPU cards and two half-height PCIe 5.0 x16 slots, which are designed to enhance HPC and deep learning performance.
The Transport HX FT65T-B8050 is a rack-convertible pedestal server platform featuring a single AMD EYPC 9004 Series processor, eight DDR5 RDIMM slots, eight 3.5" SATA and two 2.5" NVMe U.2 hot-swap, tool-less drive trays. The FT65T-B8050 supports up to two double-wide PCIe 5.0 x16 professional GPU cards, along with two additional high-speed networking adapters that are ideal for desk-side AI workbench workloads.
Unparalleled Performance AM5 platform and multi-node servers to power the cloud
The Tomcat CX S8016 is an AMD Ryzen™ 7000 Processor-based server motherboard designed with an onboard BMC (Baseboard Management Controller) for CSP deployment in micro-ATX form factor (9.6" x 9.6"). The motherboard is purpose-built for the new AMD socket AM5 platform, featuring four DDR5 UDIMM slots, one PCIe 5.0 x16 slot, two NVMe M.2 slots and two onboard GbE ports.
The Transport CX TD76-B8058 is a 2U multi-node server platform designed for high-density data center deployment, front-end web servers, and various scale-out applications. The platform includes four front-serviced nodes, each node supports one AMD EPYC 9004 Series processor, 16 DDR5 RDIMM slots, four hot-swap E1.S drive trays, two NVMe M.2 slots, one standard PCIe 5.0 x16 expansion, and one OCP 3.0 LAN mezzanine slot.
Hybrid and all-flash storage servers to maximize data streaming performance
TYAN's storage platforms are designed to deliver massive data I/O between memory and storage devices for data centers. The Transport SX TS70-B8056 and Transport SX TS70A-B8056 are 2U single-socket storage servers that support 24 DDR5 RDIMM slots, three standard PCIe 5.0 expansion slots, and one OCP 3.0 LAN mezzanine slot.
The TS70-B8056 accommodates twelve front 3.5" drive trays with up to four NVMe U.2 support, and two rear 2.5" NVMe U.2 hot-swap, tool-less drive trays for boot drive deployment. Meanwhile, the TS70A-B8056 offers 26 2.5" NVMe U.2 hot-swap, tool-less drive trays for high IOPs requirements in high-performance data streaming applications.
Created in 1989, TYAN designs, manufactures and markets advanced x86 server/workstation platforms. TYAN’s products are sold to OEMs, VARs, System Integrators, and Resellers around the world for a wide range of applications. As a leading server brand asset owned by MiTAC International Corporation, TYAN is to be deeply enhanced and further developed through the synergy and innovation of the new MiTAC.
APPLICATION INFRASTRUCTURE, WINDOWS SYSTEMS AND NETWORK
businesswire | April 26, 2023
Alphawave Semi, a global leader in high-speed connectivity for the world’s technology infrastructure, today announced the bring-up of its first connectivity silicon platform on TSMC’s most advanced 3nm process with its ZeusCORE Extra-Long-Reach (XLR) 1-112Gbps NRZ/PAM4 serialiser-deserialiser (“SerDes”) IP.
An industry-first live demo of Alphawave Semi’s silicon platform with 112G Ethernet and PCIe 6.0 IP on TSMC 3nm process will be unveiled at the TSMC North America Symposium in Santa Clara, CA on April 26, 2023.
The 3nm process platform is crucial for the development of a new generation of advanced chips needed to cope with the exponential growth in AI-generated data, and enables higher performance, enhanced memory and I/O bandwidth, and reduced power consumption. ZeusCORE XLR Multi-Standard-Serdes (MSS) IP is the highest performance SerDes in the Alphawave Semi product portfolio and on the 3nm process will pave the way for the development of future high performance AI systems. It is a highly configurable IP that supports all leading edge NRZ and PAM4 data center standards from 1112 Gbps, supporting diverse protocols such as PCIe Gen1 to Gen6 and 1G/10G/25G/50G/100 Gbps Ethernet.
This flexible and customizable connectivity IP solution together with Alphawave Semi's chiplet-enabled custom silicon platform which includes IO, memory and compute chiplets, allows end-users to produce high performance silicon specifically tailored to their applications. Customers can benefit from Alphawave Semi’s application optimized IP-subsystems and advanced 2.5D/3D packaging expertise to integrate advanced interfaces such Compute Express Link (CXL™), Universal Chiplet Interconnect Express™ (UCIe™), High Bandwidth Memory (HBMx), and Low-Power Double Data Rate DRAM (LP/DDRx/) onto custom chips and chiplets.
“We are thrilled to be one of the first companies to successfully demonstrate our highest performance silicon platform with our XLR 112G Ethernet and PCIE6.0 SerDes IP on TSMC’s most advanced 3nm technology,” said Tony Pialis, CEO and co-founder of Alphawave Semi. “This represents a significant step forward in our execution of Alphawave Semi’s strategy to be a vertically integrated semiconductor leader in high-speed connectivity. Thanks to our rapidly growing partnership with TSMC through the Open Innovation Platform® (OIP), we continue to deliver innovative, high-performance custom silicon and IP solutions to our customers in data center, compute, networking, AI, 5G, autonomous vehicles, and storage applications.”
“Alphawave Semi continues to see growing demand from our hyperscaler customers for purpose-built silicon with very high-speed connectivity interfaces, fueled by an exponential increase in processing of AI-generated data,” said Mohit Gupta, SVP and GM, Custom Silicon and IP, Alphawave Semi. “We're engaging our leading customers on chiplet-enabled 3nm custom silicon platforms which include IO, memory, and compute chiplets. Our Virtual Channel Aggregator (VCA) partnership with TSMC has provided invaluable support, and we look forward to accelerating our customers' high-performance designs on TSMC's 3nm process.”
About Alphawave Semi
Alphawave Semi is a global leader in high-speed connectivity for the world's technology infrastructure. Faced with the exponential growth of data, Alphawave Semi's technology services a critical need: enabling data to travel faster, more reliably and with higher performance at lower power. We are a vertically integrated semiconductor company, and our IP, custom silicon, and connectivity products are deployed by global tier-one customers in data centers, compute, networking, AI, 5G, autonomous vehicles, and storage. Founded in 2017 by an expert technical team with a proven track record in licensing semiconductor IP, our mission is to accelerate the critical data infrastructure at the heart of our digital world.