HYPER-CONVERGED INFRASTRUCTURE, APPLICATION STORAGE
IDTechEx | March 27, 2023
Thermal Interface Material (TIM) plays an important role in power electronics, computing processors, sensors, and energy storage devices. TIMs are the materials used to fill the void between heat sources and heat sinks to enhance heat transfer. TIMs come in a variety of forms, including gap pads, thermal greases, thermally conductive adhesives, and phase change materials. The form varies significantly across target application areas, cost, and ease of mass deployment. With the ever-increasing power demand and heat generation for many emerging industries, such as data centers, 5G, and advanced driver-assistance systems (ADAS), TIMs are experiencing rapid growth and evolution, leading to significant market opportunities and massive potential for each of the target industries.
Electric Vehicles (EVs) are a fast-growing market; IDTechEx forecasts that electric vehicle markets across land, sea, and air will generate US$2.6 trillion by 2042 with a double-digit annual growth rate. The battery is undoubtedly one of the most important components of an EV. Together with the fast adoption of EVs, there is also a trend for higher power density, larger battery capacity, and faster charging.
TCAs have the fastest growth but gap fillers retain their dominant position over the next ten years. Source: IDTechEx - "Thermal Interface Materials 2023-2033: Technologies, Markets and Opportunities".
The most used TIM forms in the EV battery industry include gap pads, gap fillers, and thermally conductive adhesives (TCAs). There is no "one-size-fits-all" solution when it comes to TIM form, and the choice is ultimately subject to battery design configuration. Gap filler is by far the most widely adopted TIM for EV batteries at this stage, thanks to their superior ability to be efficiently dispensed at high volumes. However, in order to increase energy density and achieve a longer range, EV batteries have been shifting from modular to cell-to-pack designs. This shift is expected to have profound impacts on the adoption of TIMs. Modular battery designs consist of multiple individual battery modules connected to form a battery pack. Each module has a separate casing and requires a separate TIM to transfer heat from the cell to the cooling system. In contrast, the cell-to-pack design combines the battery cells into a single, large battery module, eliminating the need for separate module housings and TIMs.
This battery transition reduces TIM usage per vehicle as there are fewer thermal interfaces between the cells and the cooling plate. The elimination of module housings means cells can directly contact the cooling plate, thereby changing the performance requirements of the TIM. The TIM needs to transfer heat efficiently to avoid hotspots, as well as present good material compatibility with the cold plate. As the TIMs are positioned directly between the cells and the cold plate, an increased adhesion of TIMs is needed to stick the cells and cold plates together. Therefore, IDTechEx forecasts thermally conductive adhesives to be increasingly adopted thanks to this battery design transition, and by 2020, the market size of TCA within the EV industry is expected to have a 15-fold increase. More details about the opportunities associated with this transition are included in IDTechEx's latest research, "Thermal Interface Materials 2023-2033: Technologies, Markets and Opportunities".
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APPLICATION INFRASTRUCTURE, WINDOWS SERVER MANAGEMENT
Lattice Semiconductor | March 01, 2023
On February 28, 2023, the leader in low-power programmable semiconductors, Lattice Semiconductor, expanded its Lattice ORANTM solution stack to assist flexible, secure synchronization and timing for Open Radio Access Network (ORAN) implementations. Lattice ORANTM now supports tight synchronization for ORAN fronthaul interfaces adherence with critical ITU (International Telecommunication Union) profiles and IEEE (Institute of Electrical and Electronics Engineers) standards. This enhances the stack's ability to accelerate and secure current and next-generation customer applications.
The latest Lattice ORANTM solution stack (v 1.1) has built-in mutual authentication for secure synchronization and support for
IEEE Standards, including IEEE Std 1588™-2019 (default profile) and IEEE Std 802.1AS™-2020, made for Time Sensitive Networks (TSN).
ITU-T Telecom Profiles, which includes frequency synchronization (G.8265.1), Phase/time synchronization with incomplete timing support (G.8275.2) and Phase/time synchronization with complete timing support (G.8275.1).
ITU-T Timing Characteristics of T-BC and T-TSC Class C (G.8273.2)
In addition, a Lattice FPGA-based development platform has been incorporated into the Lattice ORANTM stack. FPGA stands for Field Programmable Gate Array, and it is an integrated circuit (IC) that facilitates the rapid prototyping and final system design of custom logic. The Secure Timing and Synchronization Kit are intended to simplify the testing, exhibition, and creation of novel telecommunications applications.
About Lattice Semiconductor
Lattice Semiconductor is a global leader in low-power programmable solutions, providing cutting-edge technology to meet customers' needs in various markets. Its commitment to world-class support allows customers to quickly and easily unleash innovation to create an innovative, secure, and connected world. Its innovations include the Field Programmable Gate Array (FPGA), an integrated circuit that enables the development of custom logic for rapid prototyping and final system design. The company is headquartered in Hillsboro, Oregon, with major operations in San Jose, California; Shanghai, China; and Manila, Philippines.
HYPER-CONVERGED INFRASTRUCTURE, APPLICATION INFRASTRUCTURE
CDS | February 01, 2023
Leading multi-vendor services (MVS) provider for data centers, CDS, recently announced its record YoY growth, a 15% rise in revenue compared to 2021.
With a strong emphasis on boosting efficiency and finding practical, affordable solutions to optimize data centers, CDS has released two key updates to its software platform. First, the Raytrix MVS platform gets the new Enterprise Pricing Module, which enables customers to get faster data center maintenance quotes. The latest update with direct access to the CDS pricing engine enable partners to accelerate revenue opportunities by generating pricing quotes more quickly.
The new Data Center Modernization Assessment Service by CDS helps partners identify opportunities and unlock savings in their existing enterprise systems. Additionally, this service increases its monitoring capabilities and doubled CDS’ capacity to connect with more enterprise storage systems, find possible issues, and fix them before they impact performance.
Daniel Newton, CEO of CDS, said, “Our partner-first approach, coupled with our deep industry expertise, continues to build trust with our OEM partners and their major customers.” He further added, “With economic uncertainty being a top concern for many enterprises today, we’re looking out for their cost and operational efficiencies so they can focus on meeting the needs of their customers. In 2023, CDS is looking to expand our global footprint by increasing recognition of the strategic and cost-effective importance that multi-vendor services can bring to data centers and IT organizations worldwide.”
(Source – Business Wire)
CDS is the top supplier of multi-vendor support (MVS) services for data centers. High-end storage, server, and network devices are supported for mission-critical data centers via its Raytrix MVS software platform. Through OEMs and channel partners, CDS provides post-warranty support services for a variety of customers across the Americas, EMEA, Asia Pacific, and Japan. The company's maintenance and support services are created to increase the return on investment for these systems by extending the useful life of the IT infrastructure of its clients. With the help of its partnerships with the top worldwide providers of data center infrastructure, CDS is supporting over 700 customers in 45 countries to unlock data center spending across business IT infrastructure with various maintenance needs and cost containment requirements.