HYPER-CONVERGED INFRASTRUCTURE, APPLICATION INFRASTRUCTURE
Lacework | February 27, 2023
Lacework, the data-driven cloud security company, recently announced that Verifone, a global leader in FinTech and payment solution provider to the world's biggest brands, has chosen the Lacework Polygraph Data Platform to secure its cloud infrastructure as it moves to a cloud-native DevSecOps model.
Verifone processes 12+ billion transactions annually, roughly 46% of the world's non-cash payments. Due to the significant number of transactions processed, the company required a dedicated cloud-native security platform.
Luke Clinch, Global Director of Infrastructure, Verifone, said, "With Lacework's behavioral ML-led approach, we'll dramatically reduce security alerting while automating key audit data delivery so that we can focus on the secure development of new products for our customers. The Polygraph Data Platform will completely transform the way our security team works."
(Source – CISION PR Newswire)
Andreas Schneider, EMEA Field CISO, Lacework, said, "As companies modernize their infrastructure, it's imperative they have a security partner that can innovate alongside them, helping extend the capabilities of their human teams to further improve and secure their service for customers."
(Source – CISION PR Newswire)
Verifone, using the Polygraph Data Platform, will take advantage of the Cloud-Native Application Protection Platform (CNAPP). This will reduce several point tools and help the organization eliminate and detect vulnerabilities in multi-cloud configuration, Infrastructure-as-Code (IaC), containers, Kubernetes, applications, and their dependencies. To automate audit and compliance processes, the Verifone security team will use Polygraph Platform compliance assessments and continuous posture. Lacework integrates easily with DevOps and CI/CD pipelines, helping Verifone make security a build-time priority and advance its DevSecOps model.
Lacework is a premier Cloud-Native Application Protection Platform (CNAPP). Lacework can gather, analyze, and reliably correlate data across an organization's Azure, AWS, Google Cloud, and Kubernetes environments without manually creating rules and reducing them to the few security incidents that matter. DevOps teams around the globe trust Lacework to secure cloud-native applications across the lifecycle ranging from code to cloud.
KIOXIA America, Inc. | January 09, 2023
Leading flash memory and SSD supplier, Kioxia, showcased new products and technologies designed to be future-ready at this year’s CES 2023.
Kioxia was the first to introduce NAND and 3D flash memory drives, and today, KIOXIA’s varied portfolio of flash storage solutions is designed to meet the ever-changing technological environment, where evolving standards drive performance levels higher.
The SSD products made by KIOXIA are built with BiCS FLASHTM 3D flash memory, which makes them ideal for client PCs, enterprise servers and storage, and cloud data centers. Kioxia’s flash memory and solid-state drives (SSD), are used to power vital information infrastructure like data centers, smartphones, PCs, and other devices that are important to people's lives worldwide.
"Whether it's the next connected vehicle, the next personal mobility device or the next smart city – we keep advancing flash memory to make the next thing possible, Countless consumer devices and applications require flash memory and SSDs, and we are committed to continued innovation."
Alex Mei, vice president of corporate marketing for KIOXIA America, Inc.
KIOXIA CES exhibit at the Venetian® Meeting Center from January 5-7 included:
Scalable BiCS FLASH™ 3D flash memory technology solutions – including XL-FLASH™ and 4-bit per cell quad-level-cell (QLC) technology
Flash memory solutions for automotive, consumer and industrial applications – including SLC NAND, UFS 4.0 and XFMEXPRESS™
A broad lineup of KIOXIA SSDs - representing the latest standards, technologies, and form factors
KIOXIA client SSDs – including XG8 and BG5 Series NVMe™ SSDs
About KIOXIA America, Inc
KIOXIA America, Inc. is the U.S. subsidiary of KIOXIA Corporation. From the creation of flash memory to the ground-breaking BiCS FLASHTM 3D technology of today, KIOXIA has led the way in developing cutting-edge memory, SSD, and software solutions that improve people's lives and broaden the boundaries of society. The company's Yokkaichi Plant is one of the world's largest and highly efficient flash memory manufacturing facilities. In addition, the company continues to meet the increasing demand for memory worldwide by deploying advanced manufacturing processes that use AI.
HYPER-CONVERGED INFRASTRUCTURE, APPLICATION STORAGE
IDTechEx | March 27, 2023
Thermal Interface Material (TIM) plays an important role in power electronics, computing processors, sensors, and energy storage devices. TIMs are the materials used to fill the void between heat sources and heat sinks to enhance heat transfer. TIMs come in a variety of forms, including gap pads, thermal greases, thermally conductive adhesives, and phase change materials. The form varies significantly across target application areas, cost, and ease of mass deployment. With the ever-increasing power demand and heat generation for many emerging industries, such as data centers, 5G, and advanced driver-assistance systems (ADAS), TIMs are experiencing rapid growth and evolution, leading to significant market opportunities and massive potential for each of the target industries.
Electric Vehicles (EVs) are a fast-growing market; IDTechEx forecasts that electric vehicle markets across land, sea, and air will generate US$2.6 trillion by 2042 with a double-digit annual growth rate. The battery is undoubtedly one of the most important components of an EV. Together with the fast adoption of EVs, there is also a trend for higher power density, larger battery capacity, and faster charging.
TCAs have the fastest growth but gap fillers retain their dominant position over the next ten years. Source: IDTechEx - "Thermal Interface Materials 2023-2033: Technologies, Markets and Opportunities".
The most used TIM forms in the EV battery industry include gap pads, gap fillers, and thermally conductive adhesives (TCAs). There is no "one-size-fits-all" solution when it comes to TIM form, and the choice is ultimately subject to battery design configuration. Gap filler is by far the most widely adopted TIM for EV batteries at this stage, thanks to their superior ability to be efficiently dispensed at high volumes. However, in order to increase energy density and achieve a longer range, EV batteries have been shifting from modular to cell-to-pack designs. This shift is expected to have profound impacts on the adoption of TIMs. Modular battery designs consist of multiple individual battery modules connected to form a battery pack. Each module has a separate casing and requires a separate TIM to transfer heat from the cell to the cooling system. In contrast, the cell-to-pack design combines the battery cells into a single, large battery module, eliminating the need for separate module housings and TIMs.
This battery transition reduces TIM usage per vehicle as there are fewer thermal interfaces between the cells and the cooling plate. The elimination of module housings means cells can directly contact the cooling plate, thereby changing the performance requirements of the TIM. The TIM needs to transfer heat efficiently to avoid hotspots, as well as present good material compatibility with the cold plate. As the TIMs are positioned directly between the cells and the cold plate, an increased adhesion of TIMs is needed to stick the cells and cold plates together. Therefore, IDTechEx forecasts thermally conductive adhesives to be increasingly adopted thanks to this battery design transition, and by 2020, the market size of TCA within the EV industry is expected to have a 15-fold increase. More details about the opportunities associated with this transition are included in IDTechEx's latest research, "Thermal Interface Materials 2023-2033: Technologies, Markets and Opportunities".
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